Failure Analysis with Curve Tracing
RTI has a long-standing relationship with failure analysis (FA) engineers. We have a wide range of test solutions for Failure Analysis of any kind of electronic device providing the critical connection between the device under test (DUT) and the tools examining it. Our FA test solutions consider the unique needs of fault localization, device visibility, and surface access.
RTI has a global footprint in the FA lab, our solutions are used by most semiconductor companies for analysis and characterization purposes. Lab Grade and durable sockets are built to last and capable of being serviced, DUT boards and fixture interface products offer a myriad of configurations to fit your devices and toolset.
The MultiTrace curve tracer is the perfect tool for failure analysis. It has a high degree of flexibility for electrically characterizing devices to find evidence of failure. It pairs nicely with RTI fixture products and allows for a turnkey solution that simplifies communication with RTI enabling effective and rapid problem solving through informed customer support.
Curve Tracing; the Standard of Non-Destructive Testing
Curve tracing is often the first and sometimes the only failure analysis operation on devices received at an FA lab. It is considered universal and non-destructive when low power settings are used. The data it provides describes the electrical connection at the pin under controlled repeatable conditions that can be compared to other device results. Curve tracing can describe leakage failures with great precision and describe opens and shorts failures readily. With a more complex setup, supply current can be measured and more test conditions can be tried.
MultiTrace and Failure Analysis
The MultiTrace is RTI’s solution to the failure analysis challenge. This Automated DC characterization system is packed with software that makes curve tracing a complex high pin count device a simple and rapid test. Automation reduces the time it takes to characterize devices. It enables more test conditions to be tried and it improves repeatability and reproducibility of results and provides a wide view of the device continuity results in a single glance.
The MultiTrace software allows the user to save all results and any setup configuration used. This allows for a large library of results which becomes more useful as it grows. Example results from golden devices and debugged test setups can be saved and made available to other users.
Test Applications Developed by and for FA engineers
The MultiTrace hardware and software was invented by an FA engineer for FA engineers. The software has been developed by an FA engineer with input from hundreds of FA engineers. Over 30 years of product improvement has resulted in a well-honed tool for failure analysis.
Manual Switch Box and Failure Analysis
If automation is not in your budget, RTI offers support for traditional manual curve tracing methods with pathways to upgrades if needed.
RTI’s manual switch box is compatible with several RTI PCB or DUT board product lines. The switch box can be paired with an A/B switch box or cables of various length making it useful in a wide range of applications from curve tracing, IDD testing, or any application with points to measure.
Indispensable Tool for the FA Engineer
At the heart of the matter is how well the test fixture and DUT board cooperate with the test method to allow a wide range of test conditions and device observations. RTI can help you navigate the maze of choices to find the optimal set of tools to help you get the job done accurately and efficiently.
The high degree of integration between sockets, DUT Boards, fixtures, and measurement tools streamlines the analysis tool selection process by ensuring compatibility, great fit, and high functionality.
Characterization is what the FA engineer does when they search for evidence of the failure. The test methods of the MultiTrace are generic enough to be useful on any device and configurable enough to be adapted to most devices. Curve tracing is considered non-destructive and non-invasive.
Fault localization is what the FA engineer does to find the exact structure in the device that has failed. In most cases, the method used to characterize and discover the failure can be used to stimulate the device during this operation.
In most cases, fault localization refers to a collection of techniques that pair a microscope and an electrical fixture that allows the microscope to observe the silicon surface while power is applied to the failure node or whole device. The microscope is typically equipped with a very sensitive camera tuned to visible or IR wavelengths as it looks for a “Hot Spot” which is evidence that a short circuit or other failure is underlying that spot.
Qualification testing is usually done by a Reliability engineer but this function or its toolset is sometimes shared with the FA department. RTI FA products are often useful to the Reliability engineer especially when a reliability test leads to a failure that requires analysis.
RTI Test Fixtures for Failure Analysis
Useful for Fault Localizations
Cables and remote fixtures fit on most probe stations and microscopes with large stage areas. Longer cables are available to connect through the pass-through door of a light-tight cabinet as required.
Socket and Fixture Features Useful in Failure Analysis
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Open-top Lids: The most requested and most useful option, the FA open-top lid allows for direct access to the surface of the die that is facing the top of the (decapsulated) package.
Open bottom: When the surface of the die needs to be accessed for analysis faces the bottom of the package, then an open bottom socket is needed. Paired with an open bottom DUT board and fixture, this type of analysis can be enabled with only a few mm more working distance than topside applications allow.
Window Lids: Similar in principle to open-top lids, this type of lid is best for WLCSP devices that have no plastic encapsulation. These devices are essentially already decapsulated. The window lid retains the part in the socket while allowing 100% visibility of the backside for IR optical analysis techniques.
Low-profile Lids: Low profile lids allow microscope lenses to get closer to the device which is important for the highest magnification ranges
Accessibility features on DUT boards: In addition to a hole to support open bottom sockets, DUT boards can support several jumper or test point configurations and can be optimized for fixture or bench usage. RTI has many PCB options catering to FA applications
Precision: RTI durable high precision sockets last a long time whether in use or storage, you can count on an RTI socket to get the job done when you need it. High precision ensures an accurate fit for even the tiniest and small pitch devices.
Custom features as required: Modern technology is packing more features into smaller packages. MEMS devices have sensor ports and no-touch areas. RTI has experience with all these unique device types and we have no shortage of ways to deal with them while still allowing analytical access to the device needed for FA applications
Heated or cooled sockets: Failures sometimes only happen under certain thermal conditions. RTI sockets and DUT boards can have a variety of heating and cooling options using both Active and Passive technologies to keep your device at the proper test temperature while allowing analytical access to the device and reliable electrical connection.